HEAT EMITTING FAST

COOLING DOWN RAPIDLY

PROTECT COMPONENTS AND PCB EFFECTIVELY

TYPICAL APPLICATION CIRCUITS:

a.       thick film combination IC

b.       heat-sink of power circuit

c.       circuit units cooling

d.       scaled base beyond ceramic base

e.       dependable circuit beyond common type aluminum base (heat - sinker)

a.       Motor, auto: trigger, voltage adjustor

b.       Audio: output magnifier, balance magnifier, pre-set magnifier

c.       Power supply: TV power switch supply, DC/DC, AC/DC, DC/AC transformer

d.       Electrics: solid relay, transistor base

e.       Industrial power: Powerful transistor

f.        Others: solar-energy batter base, heat sinker, heat-conduction and insulating of semi-conductor

STANDARD SPECIFICATION:

Standard thickness: 1.0, 1.5, 2.0mm

Standard dimension: 490x490mm

Copper: 35, 70, 105

Heat conduction and insulating layer thickness: 60um