XPC
SPECIFICATION
|
NO |
ITEM |
UNIT |
VALUE |
|
|
1 |
peel
stRength at
normal condition: after
5s heat shock |
n/mm |
min:
1.0 min:
1.0 |
|
|
2 |
blistering
test after
10s heat shock |
|
no
obvious blister or delamination |
|
|
3 |
punching
property |
|
cold-punching |
|
|
4 |
heatproof after
60min at 130+/-2 ¡æ air |
|
no
obvious blister no copper foil peel |
|
|
5 |
copper
foil resistance |
m¦¸ |
max:
3.5 |
|
|
6 |
volume
resistivity at
normal condition: after
recovery through steady heat/humidity treatment: |
m¦¸ |
min:
5.0x105 min:
5.0x104 |
|
|
7 |
surface
resistance at
normal condition: after
recovery through steady heat/humuNIdity treatment: |
|
on
etching copper foil side min: 1.0x104 min:
1.0x103 |
on
laminating side: min:
1.0x103 min:
1.0x102 |
|
8 |
insulating
resistance at
normal condition: after
boiling in wAter: |
|
min:
5.0x104 min:
1.0x10 |
|
|
9 |
dielectric
dissipation factor at
normal condition: after
immersing in water: |
|
max:
5.5 max:
6.0 |
|
|
10 |
permitivity at
normal condition: after
immersing in water: |
|
max:
0.05 max:
0.01 |
|
|
11 |
laminates
properties etched copper foil flexural
strength |
mpa |
min:
100 |
|
|
12 |
trichloroethylen
and alkali resistance |
|
appearance
no obvious variety |
|
|
13 |
falling
ball impact |
cm |
min:
5 |
|
|
14 |
water
absorption |
% |
max:
1.8 |
|