Polyimide Copper Clad Laminates (PI)

item Property to be tested and test Method
Standard Value
(non-FR)
Standard Value
(FR)
1
Peel Strength,minimum lb./in.-width, IPC-TM-650-2.4.9
As received----------------Method B
After sold float------------Method D
-
9.0
9.0
　
9.0
9.0
2 Tensile Strength, minimum lb./in
24,000
24,000
3 Elongation, minimum percent
40
40
4 Initiation tear strength, minimum gms
500
300
5 Propagation tear strength, minimum gms,1 to 5 mils film thickness
10
10
6 Flexural endurance, minimum cycles
In 2000
Out 1500
1800
1200
7
Dimensional Stability, maximum,percentage
Method B
Method C
-
+/- 0.20
+/- 0.20
-
+/- 0.15
+/- 0.15
8 Low temperature flexbility
Pass
Pass
9 Solder float,IPC-TM-650-2.4.13 Method A
                                                  Mothod Ｂ		 260℃Pass(EDHD)
288℃Pass(RA)		 260℃Pass(EDHD)
288℃Pass(RA)
10 Flammability, IPC-TM-650-2.3.8
--------
94V-0
11 Chemical Resistance percentage,
Method A
80
80
12 Dielectric constant, maximum(at 1 MHz)
3.50
3.51
13 Dissipation factor, maximum(at 1 MHz)
0.015
0.018
14 Volume Resistivity,minimum megohms-cm
107
109
15 Surface resistance, minimum megohms

105

105
16 Dielectric strength, minimum volts/mil,
ASTM-D-149
3500
2500
17 Insulation resistance, minimum,megohms, at ambient
105
105
18 Moisture and Insulation Resistance, minimum, megohms
104
105
19 Moisture Absorption, maximum, percent
4.0
4.0
  1. The data is typical for 1 mil PI *1 Oz/SF EDHD Copper structure.